Wear/abrasion resistant steel is used in highly abrasive environments within the mining, cement, aggregate, and various ground engaging applications. All of our NM400(equivalent to XAR400/EH400), NM450(equivalent to XAR450/EH450) and NM500 (equivalent to
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
bonding wedge tools tool to be used in our production
ball bonder with accessories
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
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Price difference upgrade: Monthly payment package+7 days free, annual payment package+15 days free
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