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Factory Directly Low Price Customized mcvd-1/16-828-45-c-2025-m-a8d
mcvd-1/16-828-45 csf-2020-m-a8d
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
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Place of Origin: China
Brand Name: SRTC
Gold Wire Standard: 16μm, 18μm, 20μm, 25μm, 50μm
Gold Belt Standard: 60μm, 75μm, 125μm
Application: Semiconductor Packaging
Material: Tungsten Carbide,Titanium Carbid
Compatibal With: Wire bonders like Palomar, Hesse, F&K, West-Bond, TPT, MPP and all kinds of bonders made in China.
Lifespan: Estimated at 50,000 points, more than twice of the top competitors in the market.
Packing Detail: Plastic tubes in plastic box.
Supply Ability: 100000 pieces per month.

Lead Time:
Quantity (pcs) 1-100 100-1000 >1000
Lead time (days) 7 14 To be negociated
Wedge Customized: Available
Solution Customized: Available
Customized Logo: Available with MOQ 100 pcs
Customiazed Package: Available with MOQ 100 pcs
For more customization information, please contact the supplier.

Company Information:
We have advanced production, surface treatment and material inspection equipment, as well as first-class quality control testing laboratories. If that's not impressive enough, our team consists of scientific experts with unrivalled knowledge in materials science, metallurgy and engineering.
Factory Display:

SRTC’s bonding wedges are known for our fine precision and high performance:
1. Fine precision: The bonding wedges of SRTC are manufactured with tight tolerances and high-quality materials, which can result in accurate and consistent wire bonding results.
2. Durability: The bonding wedges of SRTC are designed to withstand the rigors of wire bonding processes, ensuring long-term reliability and performance.
3. Customization: SRTC can offer a range of bonding wedge shapes and sizes to accommodate different wire bonding requirements, allowing for flexibility and customization based on specific application needs.
4. Enhanced bonding quality: The use of SRTC’s bonding wedges improves bonding quality, bonding strength and overall process reliability, resulting in higher yields and fewer production problems.

Product Details:

Q1: What is your MOQ?
A: No min order quantity for bonding wedge tools.

Q2: Can I get a sample of bonding wedge for quality check?
A: Sample is available.
Q3: How can I get a price of needed bonding wedges?
A: If available, please send me your model number and required quantity for pricing. If it’s customized, please send us technical requirements for quotation.
Q4: Can you customize the bonding wedges according to our requirements?
A: Yes, customization is available. Please send us your technical requirements for designing.  

Q5: Beside bonging wedge tools, can you also supply other related accessories and equipment?
A: Yes, we can. We are committed to providing quality products and technical service for the electronic packaging industry, focusing on the development and sales of advanced packaging materials & precision tools. We can provide one-stop solutions for electronic products packaging.

Q6: What kind of payment terms would you accept?
A: We usually accept T/T. If you prefer other payments terms, please feel free to discuss with us.

Q7: We want to be your agent of our area. How to apply for this?
A: Please send your idea and your profile to any of us for further discussing and cooperating.

Q8: Could you send me the price list?
A: Yes, the wedges are non-standard for different areas, please send us your specifications and models you use for pricelist.
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Payment Info
Payment Company: 广州联雅科技发展有限公司
Payment Account: 44044301040010464
Bank Name: 中国农业银行广州房建支行
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