High End Standard Tungsten Carbide Wire Bonding Wedge Tool Of Different Series Like mcvd 1/16 750 45 c 1510 m a8d
mcvd 1/16 750 45 c 2020 m a8d
mcvd 1/16 750 45 c 1510 m a8d
mknlve-1-16-750-45-c-3530-m-a8d
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
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