Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
Wire bonding is a crucial step to form electrical connections between the silicon die and the external lead frame. The wedges are designed for the placing and bonding of gold wires during the assembly of integrated circuits for the electronic packaging.
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